The service includes product wafer level circuit probing (CP) and package level final test (FT) program development, testing hardware design and manufacturing and production test management. The test solutions enable the program development first cut work with short cycle time and faster time-to-market.
Our extensive test engineering staff provides complete test program / hardware development services.
We offer following testing services :
- Wafer Level
- Package Level
- Turnkey Test Solutions with Test Development