Tekstart offers a full suite of assembly services to meet our customers’ semiconductor packaging needs, including leadframe, laminate, flip chip interconnect and advanced wafer level technology.
Tekstart differentiates itself by providing a comprehensive platform of wafer level technology that includes Fan-in Wafer Level Packaging (FIWLP), Fan-out Wafer Level Packaging (FOWLP), Integrated Passive Devices (IPD) and Through Silicon Via (TSV) to meet the increasing market demand for next generation devices with higher levels of integration, increased functionality and compact sizes.
We collaborate with customers on die and package designs to provide the best possible products in terms of performance, quality, cycle time and cost.
We supports the following package technologies:
- Flip Chip Packages
- System-in-Package (SiP)
- Wafer Level Packages (WLP)
- Wirebond Packages